Wang, X., Li, Z., Li, X., Gao, C., Pu, Y., Zhong, X., Qian, J., Zeng, M., Chu, X., Chen, Z., Redshaw, C., Zhou, H., Sun, C., Regier, T., King, G., Dynes, J. J., Zhang, B., Zhu, Y., Li, G., Peng, Y., …Wu, Y. A. (online). Embedding Reverse Electron Transfer Between Stably Bare Cu Nanoparticles and Cation-Vacancy CuWO4. Advanced Materials, https://doi.org/10.1002/adma.202412570