Sensitivity of embedded component temperature to PCB structure and heat transfer coefficient
(2003)
Journal Article
Stubbs, D. M., Wilkinson, A. J., & Pulko, S. H. (2003). Sensitivity of embedded component temperature to PCB structure and heat transfer coefficient. IEE Proceedings Circuits Devices and Systems, 150(1), 73-77. https://doi.org/10.1049/ip-cds%3A20030184
The sensitivity of embedded component temperature to the location of an embedded copper ground plane is investigated using computer simulation. The results show that the presence of a copper ground plane in close proximity to a component layer improv... Read More about Sensitivity of embedded component temperature to PCB structure and heat transfer coefficient.