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Thin Implicit Utah Teapot: Design for Additive Manufacturing (2018)
Conference Proceeding
Qi, Q., & Li, Q. (2018). Thin Implicit Utah Teapot: Design for Additive Manufacturing. In 2018 IEEE International Conference on Internet of Things (iThings) and IEEE Green Computing and Communications (GreenCom) and IEEE Cyber, Physical and Social Computing (CPSCom) and IEEE Smart Data (SmartData) (1933-1940). https://doi.org/10.1109/Cybermatics_2018.2018.00320

© 2018 IEEE. Converting a surface-based geometric object into a thin solid is an essential requirement for additive manufacturing. Although offset surface and thickening techniques have been widely used for this task, it is in general difficult to mo... Read More about Thin Implicit Utah Teapot: Design for Additive Manufacturing.