All Outputs (2)

REVERSE TIME TLM MODELING OF THERMAL PROBLEMS DESCRIBED BY THE HYPERBOLIC HEAT CONDUCTION EQUATION (2003)
Journal Article
Koay, A., Pulko, S., & Wilkinson, A. (2003). REVERSE TIME TLM MODELING OF THERMAL PROBLEMS DESCRIBED BY THE HYPERBOLIC HEAT CONDUCTION EQUATION. Numerical Heat Transfer, Part B Fundamentals, 44(4), 347-363. https://doi.org/10.1080/713836408

A method for reverse-time transmission line matrix (TLM) modeling of thermal diffusion problems described by the hyperbolic heat conduction equation is presented. The method involves pulse scattering governed by the inverse of the usual scattering ma... Read More about REVERSE TIME TLM MODELING OF THERMAL PROBLEMS DESCRIBED BY THE HYPERBOLIC HEAT CONDUCTION EQUATION.

Sensitivity of embedded component temperature to PCB structure and heat transfer coefficient (2003)
Journal Article
Stubbs, D. M., Wilkinson, A. J., & Pulko, S. H. (2003). Sensitivity of embedded component temperature to PCB structure and heat transfer coefficient. IEE Proceedings Circuits Devices and Systems, 150(1), 73-77. https://doi.org/10.1049/ip-cds%3A20030184

The sensitivity of embedded component temperature to the location of an embedded copper ground plane is investigated using computer simulation. The results show that the presence of a copper ground plane in close proximity to a component layer improv... Read More about Sensitivity of embedded component temperature to PCB structure and heat transfer coefficient.