A. J. Kelly
An Al-Si-Ti hierarchical metal-metal composite manufactured by co-spray forming
Kelly, A. J.; Mi, J.; Sinha, G. V.; Krug, P.; Crosa, F.; Audebert, F.; Grant, P. S.
Professor Jiawei Mi J.Mi@hull.ac.uk
Professor of Materials
G. V. Sinha
P. S. Grant
Spray forming with co-injection of a solid particulate phase to form a homogeneous distribution within the final spray formed billet has been studied as a new route to manufacturing metal-metal composites at large scale with negligible oxide. 12 wt%Ti particles were co-injected into an atomised Al alloy droplet spray and co-deposited to form a ∼300 kg billet at Peak Werkstoff GmbH, Germany. The microstructure comprised refined equiaxed α-Al grains (∼5 μm), spherical Si particles (∼1 μm) and uniformly distributed Ti particles (∼80 μm). Sections of the billet were extruded under a range of conditions into long strips 20 mm wide and 6 mm, 2.5 mm and 1 mm thickness. At high strains, the Ti particles were deformed into continuous fibres of a few microns in thickness. The large interfacial area between the fcc α-Al and hcp Ti inhibited dislocation motion and enhanced tensile properties. Accumulative roll bonding was then performed to higher total strains, while maintaining a constant cross-section, reducing the Ti fibres to sub-micron thickness. The fibres were studied by extraction after selective dissolution of the α-Al matrix. There was no interfacial reaction between α-Al and Ti or any measurable oxide formation.
Kelly, A. J., Mi, J., Sinha, G. V., Krug, P., Crosa, F., Audebert, F., & Grant, P. S. (2011). An Al-Si-Ti hierarchical metal-metal composite manufactured by co-spray forming. Journal of Materials Processing Technology, 211(12), (2045-2049). doi:10.1016/j.jmatprotec.2011.07.001. ISSN 0924-0136
|Journal Article Type||Article|
|Acceptance Date||Jul 2, 2011|
|Online Publication Date||Jul 7, 2011|
|Journal||Journal of Materials Processing Technology|
|Peer Reviewed||Peer Reviewed|
|Keywords||Co-spray forming; Metal–metal composite; Extrusion; Accumulated roll-bonding (ARB); Electron backscattered diffraction (EBSD)|