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All Outputs (10)

The effect of beat interval on ventricular repolarisation in atrial fibrillation (2019)
Presentation / Conference Contribution
Al-Karadi, M. S., Wilkinson, A. J., & Langley, P. (2019). The effect of beat interval on ventricular repolarisation in atrial fibrillation. . https://doi.org/10.22489/CinC.2018.294

© 2018 Creative Commons Attribution. Atrial fibrillation (AF) is characterised by rapid beat interval changes. The aim of the study was to investigate the effect of such changes on ECG ventricular repolarisation characteristics. In 10 AF recordings b... Read More about The effect of beat interval on ventricular repolarisation in atrial fibrillation.

A phase modulation-based ultrasonic communication system using Variable Structure Control (2010)
Presentation / Conference Contribution
Ma, S., Wilkinson, A. J., & Paulson, K. S. (2010). A phase modulation-based ultrasonic communication system using Variable Structure Control. . https://doi.org/10.1109/icct.2010.5688708

Narrow bandwidth transducers used in existing ultrasonic data communication systems are known to be devices with a high Q resonant response and low coupling to both the electrical drive and acoustic output interfaces. These features limit the speed o... Read More about A phase modulation-based ultrasonic communication system using Variable Structure Control.

An investigation of the sensitivity of embedded passive component temperatures to PCB structure (2002)
Presentation / Conference Contribution
Stubbs, D. M., Pulko, S. H., & Wilkinson, A. J. (2002). An investigation of the sensitivity of embedded passive component temperatures to PCB structure. IEEE Transactions on Components and Packaging Technologies, 25(4), 701-707. https://doi.org/10.1109/TCAPT.2002.806175

The embedding of passive components such as resistors, capacitors and inductors within printed circuit boards (PCBs) is motivated, to a large extent, by the desire for increased miniaturization of electronic goods. However, resistors and, to a lesser... Read More about An investigation of the sensitivity of embedded passive component temperatures to PCB structure.