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An investigation of the sensitivity of embedded passive component temperatures to PCB structure

Stubbs, David M.; Pulko, Susan H.; Wilkinson, Anton James

Authors

David M. Stubbs

Susan H. Pulko

Dr Antony Wilkinson A.J.Wilkinson@hull.ac.uk
Lecturer/ Programme Director for Electronic, and Electrical & Electronic Engineering Programmes



Abstract

The embedding of passive components such as resistors, capacitors and inductors within printed circuit boards (PCBs) is motivated, to a large extent, by the desire for increased miniaturization of electronic goods. However, resistors and, to a lesser extent, inductors are heat generating devices, and the temperature developed within PCBs as the result of the operation of embedded passives is an important aspect of multilayer PCB design. Many factors can influence the generation of heat inside such embedded structures, and, in this paper, validated numerical simulations are used to investigate the temperature rises associated with embedded resistors. Sensitivity of temperature rises to PCB structural changes are investigated in terms of embedded resistor temperature and in terms of interaction with other neighboring components on the same and adjacent component layers.

Journal Article Type Conference Paper
Publication Date Dec 31, 2002
Journal IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Print ISSN 1521-3331
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 25
Issue 4
Pages 701-707
APA6 Citation Stubbs, D. M., Pulko, S. H., & Wilkinson, A. J. (2002). An investigation of the sensitivity of embedded passive component temperatures to PCB structure. IEEE Transactions on Components and Packaging Technologies, 25(4), 701-707. doi:10.1109/TCAPT.2002.806175
DOI https://doi.org/10.1109/TCAPT.2002.806175
Keywords Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials
Publisher URL https://ieeexplore.ieee.org/document/1178782
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