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Thin Implicit Utah Teapot: Design for Additive Manufacturing

Qi, Quan; Li, Qingde


Quan Qi


Qi, Q., & Li, Q. (2018). Thin Implicit Utah Teapot: Design for Additive Manufacturing. In Proceedings iThings/GreenCom/CPSCom/SmartData/Blockchain/CIT/Cybermatics 2018doi:10.1109/Cybermatics_2018.2018.00320

Conference Name The 18th IEEE International Conference on Computer and Information Technology
Start Date Jul 30, 2018
End Date Aug 3, 2018
Acceptance Date May 1, 2018
Publication Date Aug 3, 2018
Deposit Date Aug 29, 2018
Book Title Proceedings iThings/GreenCom/CPSCom/SmartData/Blockchain/CIT/Cybermatics 2018
Chapter Number CIT-10: Industry 4.0 and Blockchain
ISBN 978-1-5386-7975-3
Public URL