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Thin Implicit Utah Teapot: Design for Additive Manufacturing

Qi, Quan; Li, Qingde

Authors

Quan Qi



Abstract

© 2018 IEEE. Converting a surface-based geometric object into a thin solid is an essential requirement for additive manufacturing. Although offset surface and thickening techniques have been widely used for this task, it is in general difficult to model the material structures with these techniques. Taking Utah teapot for example, this paper presents a surface-To-Thin solid conversion method using implicit modelling technique. With the proposed technique, any explicitly represented surface object can be directly converted into a solid represented as a collection of implicit thin patches. Due to the easy-blending nature of implicit models, any required complex material structures can be easily integrated into a converted thin-solid model. Experimental results show that the proposed method is an effective solid modelling technique for 3D printing and additive manufacturing of surface-based geometries.

Citation

Qi, Q., & Li, Q. (2018, July). Thin Implicit Utah Teapot: Design for Additive Manufacturing. Presented at The 18th IEEE International Conference on Computer and Information Technology

Conference Name The 18th IEEE International Conference on Computer and Information Technology
Start Date Jul 30, 2018
End Date Aug 3, 2018
Acceptance Date May 1, 2018
Publication Date Aug 3, 2018
Deposit Date Aug 29, 2018
Pages 1933-1940
Book Title 2018 IEEE International Conference on Internet of Things (iThings) and IEEE Green Computing and Communications (GreenCom) and IEEE Cyber, Physical and Social Computing (CPSCom) and IEEE Smart Data (SmartData)
Chapter Number CIT-10: Industry 4.0 and Blockchain
ISBN 9781538679753
DOI https://doi.org/10.1109/Cybermatics_2018.2018.00320
Public URL https://hull-repository.worktribe.com/output/1004017