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Thin Implicit Utah Teapot: Design for Additive Manufacturing

Qi, Quan; Li, Qingde

Authors

Quan Qi

Start Date Jul 30, 2018
Publication Date Aug 3, 2018
Book Title Proceedings iThings/GreenCom/CPSCom/SmartData/Blockchain/CIT/Cybermatics 2018
Chapter Number CIT-10: Industry 4.0 and Blockchain
ISBN 978-1-5386-7975-3
Institution Citation Qi, Q., & Li, Q. (2018). Thin Implicit Utah Teapot: Design for Additive Manufacturing. In Proceedings iThings/GreenCom/CPSCom/SmartData/Blockchain/CIT/Cybermatics 2018doi:10.1109/Cybermatics_2018.2018.00320
DOI https://doi.org/10.1109/Cybermatics_2018.2018.00320