Quan Qi
Thin Implicit Utah Teapot: Design for Additive Manufacturing
Qi, Quan; Li, Qingde
Citation
Qi, Q., & Li, Q. (2018). Thin Implicit Utah Teapot: Design for Additive Manufacturing. In Proceedings iThings/GreenCom/CPSCom/SmartData/Blockchain/CIT/Cybermatics 2018doi:10.1109/Cybermatics_2018.2018.00320
| Conference Name | The 18th IEEE International Conference on Computer and Information Technology |
|---|---|
| Start Date | Jul 30, 2018 |
| End Date | Aug 3, 2018 |
| Acceptance Date | May 1, 2018 |
| Publication Date | Aug 3, 2018 |
| Deposit Date | Aug 29, 2018 |
| Book Title | Proceedings iThings/GreenCom/CPSCom/SmartData/Blockchain/CIT/Cybermatics 2018 |
| Chapter Number | CIT-10: Industry 4.0 and Blockchain |
| ISBN | 978-1-5386-7975-3 |
| DOI | https://doi.org/10.1109/Cybermatics_2018.2018.00320 |
| Public URL | https://hull-repository.worktribe.com/output/1004017 |
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Contact S.Bentley@hull.ac.uk to request a copy for personal use.
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