Nanotrench for nano and microparticle electrical interconnects

Dayen, J-F; Faramarzi, V.; Pauly, M.; Kemp, N. T.; Barbero, M.; Pichon, B. P.; Majjad, H.; Begin-Colin, S.; Doudin, B.

Abstract

We present a simple and versatile patterning procedure for the reliable and reproducible fabrication of high aspect ratio (10 4 ) electrical interconnects that have separation distances down to 20 nm and lengths of several hundreds of microns. The process uses standard optical lithography techniques and allows parallel processing of many junctions, making it easily scalable and industrially relevant. We demonstrate the suitability of these nanotrenches as electrical interconnects for addressing micro and nanoparticles by realizing several circuits with integrated species. Furthermore, low impedance metal-metal low contacts are shown to be obtained when trapping a single metal-coated microsphere in the gap, emphasizing the intrinsic good electrical conductivity of the interconnects, even though a wet process is used. Highly resistive magnetite-based nanoparticles networks also demonstrate the advantage of the high aspect ratio of the nanotrenches for providing access to electrical properties of highly resistive materials, with leakage current levels below 1 pA. © 2010 IOP Publishing Ltd.

Citation

Dayen, J., Faramarzi, V., Pauly, M., Kemp, N. T., Barbero, M., Pichon, B. P., …Doudin, B. (2010). Nanotrench for nano and microparticle electrical interconnects. Nanotechnology, 21(33), Article 335303. https://doi.org/10.1088/0957-4484/21/33/335303

• Journal Article Type: Article
• Acceptance Date: Jun 22, 2010
• Online Publication Date: Jul 27, 2010
• Publication Date: Aug 20, 2010
• Deposit Date: Nov 13, 2014
• Publicly Available Date: Nov 13, 2014
• Journal: Nanotechnology
• Print ISSN: 0957-4484
• Electronic ISSN: 1361-6528
• Publisher: IOP Publishing
• Peer Reviewed: Peer Reviewed
• Volume: 21
• Issue: 33
• Article Number: 335303
• DOI: https://doi.org/10.1088/0957-4484/21/33/335303
• Keywords: Mechanical Engineering; Electrical and Electronic Engineering; General Materials Science; Mechanics of Materials; Bioengineering; General Chemistry
• Public URL: https://hull-repository.worktribe.com/output/462884
• Publisher URL: http://iopscience.iop.org/article/10.1088/0957-4484/21/33/335303/meta;jsessionid=B06CC986D001CA3358228D8B63BEC9C1.c1.iopscience.cld.iop.org
• Additional Information: This is an author-created, un-copyedited version of an article accepted for publication in Nanotechnology. The publisher is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at 10.1088/0957-4484/21/33/335303.